Signal integrity (SI) is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage (or current) waveform. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where less-than-ideal conditions (errors) occur, and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. Signal integrity engineering is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), through the package, the printed circuit board (PCB), the backplane, and inter system connections. While there are some common themes at these various levels, there are also practical considerations, in particular the interconnect flight time versus the bit period, that cause substantial differences in the approach to signal integrity for on-chip connections versus chip-to-chip connections.  Some of the main issues of concern for signal integrity are ringing, crosstalk, ground bounce, distortion, signal loss, and power supply noise.

Course objectives: This course will focus on fundamental signal design, analysis and modeling methodology in advanced electronic packaging. Main topics include transmission line theory, GHz differential serial link design, timing and jitter analysis fundamental, frequency and time domain analysis, power distribution networks design and modeling, measurement techniques for SI.